Molex has launched a chip-to-chip interconnect portfolio operating at speeds of up to 224 Gbps PAM4 to support next-gen data centers and generative AI. The line comprises cables, backplanes, board-to-board connectors, and near-ASIC connector-to-cable products.
“Molex is collaborating closely with major technology innovators, as well as key data center and enterprise customers, to set an aggressive pace for 224G product introductions,” said Jairo Guerrero, VP & GM, Copper Solutions, at Molex. “Our transparent, co-development approach facilitates early engagement with stakeholders across the 224G ecosystem to identify and resolve potential performance bottlenecks and design challenges, ranging from signal integrity and EMI reduction to the need for more efficient thermal management.”
The updated portfolio features the interconnect components required to build end-to-end 224G systems requiring multiple chip-to-chip connection schemes for an optimized system design. These components include:
- Mirror Mez Enhanced—a 224-Gbps PAM4 mezzanine board-to-board connector with a genderless mating interface and mated height options;
- Inception—a genderless backplane system offering variable pitch densities, multiple wire gauge options, simplified integration, and optimal signal integrity;
- CX2 Dual Speed—a 224-Gbps PAM4 near-ASIC connector-to-cable system with screw engagement after mating, integrated strain-relief, and a reliable mechanical wipe.
Other offerings include OSFP 1600, QSFP 800, and QSFP-DD 800 I/O products, all of which feature SMT connector/cage, BiPass, Direct Attach, and Active Electrical Cable solutions. These components support 224 Gbps-PAM4 per lane or aggregate speeds of 1.6T per connector.
Samples of Mirror Mezz Enhanced, Inception, and CX2 Dual Speed will be available this summer, with product samples of OSFP and QSFP offerings slated for release in the fall.
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